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In a large metal spoon, combine 1 gram of cocaine and ½ gram of baking soda.. Otherwise, no. software mantenimiento preventivo mp8.1 crack manualesThe manufacture of integrated circuits involves a large number of processes on many different types of substrates. Often, a wafer is initially sliced from an ingot and a substrate such as a silicon wafer is then cut from the sliced wafer. These steps are well known and need not be described further herein for the purposes of this application. It is often desired to test, i.e., evaluate, the electronic properties of a silicon wafer, or portions of the wafer such as a die on the wafer, during the fabrication process. It is also often desired to test a silicon wafer after it has been diced into separate die, or at least before the dicing process has been completed.
The parameters evaluated by the testing are often correlated with the performance of the integrated circuit when the integrated circuit is eventually completed and ultimately mounted on a printed circuit board, or the like. As such, a wafer that is defective or otherwise unsuitable for the eventual integrated circuit may be identified during the testing of the wafer, or, more typically, during the manufacturing process of the integrated circuit.
Unfortunately, as noted above, the wafers often have been sliced from an ingot such as a single silicon ingot. If the wafer is to be tested after it has been diced into separate die, i.e., a wafer that has been sliced from a larger ingot of silicon, and then diced into separate die, then it will be apparent that the wafer is significantly larger than the silicon ingot that it was derived from. Accordingly, when testing the diced die, such testing typically involves contacting the dice with various probe tips and, in essence, sending an electrical signal to the die, and then evaluating the die to assess how the die may operate when finally integrated into the final integrated circuit.
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